Background
I have always assumed (or heard) that adhesives require a minimum thickness of adhesive to function properly. One example of this is not clamping two pieces of wood together so tightly that all of the glue squeezes out.
This assumption seems to be backed up by the following articles on minimum adhesive bond line:
From MasterBond:
Bond line thickness is one of the important factors to be considered in designing a bond joint. Most commonly used bond line thicknesses in a bond joint range from about 0.002 to 0.007 inches.
From Epotek:
Minimum bond line thickness often receives special attention in part specifications but, is often overlooked and seldom controlled or monitored during process and manufacturing engineering. The risks of inadequate bond line could be low strength...
Why this might not be the case
I ask about this because recently a machine shop that was fabricating a part for my design asked about adding adhesive to the connection of two components where no adhesive was specified.
The part is a press (interference) fit between two steel components.
The machine shop was offering to use a product that specifically states that it is used in interference fit situations. The idea of a minimum bond line seems to directly contradict the use of an adhesive in an interference fit. This is a white paper from the supplier that also talks about the use:
Retaining compounds are used ... for interference fitted joints: • added to existing interference fit designs to increase joint strength and reliability; ...
So which is it?
- Do adhesives have a minimum thickness (bond line)?
- Do adhesives in an interference fit have a use?